ML-740-W3BF made in JAPAN Discontinued
- Pitch 7.62mm
- 3-stage
- PCB
- Staggered array
Order model number
- Order model numberML-740-W3BF-[Position]
- Order exampleML-740-W3BF-24P (An example of ordering with 24 positions.)
Flow process solder heat resistance
| Pre Heat Temperature | 100-140℃ | 
|---|---|
| Pre Heat Times | 40 seconds | 
| Solder Immersion Temperature | 265±3℃ | 
| Soldering Times | 10±1 seconds | 
Using a Soldering Iron
| Tip Temperature | 390±10℃ | 
|---|---|
| Tip Contact Times | 5±1 seconds | 
| Number of Times | 2 | 
Note
- ・Reflow process is not applicable.
- ・Perform the second soldering with a soldering iron after the product has cooled sufficiently and returned to room temperature after the first soldering.
- ・When using the product, we recommend that you check it according to the actual conditions of use. The above conditions have been confirmed by testing the product itself.





