ML-30-AP made in JAPAN
- Pitch 9.45mm
- PCB
- Low profile
Order model number
- Order model numberML-30-AP-[Position]
Flow process solder heat resistance
| Pre Heat Temperature | 100-140℃ |
|---|---|
| Pre Heat Times | 40 seconds |
| Solder Immersion Temperature | 265±3℃ |
| Soldering Times | 10±1 seconds |
Using a Soldering Iron
| Tip Temperature | 390±10℃ |
|---|---|
| Tip Contact Times | 5±1 seconds |
| Number of Times | 2 |
Note
- ・Reflow process is not applicable.
- ・Perform the second soldering with a soldering iron after the product has cooled sufficiently and returned to room temperature after the first soldering.
- ・When using the product, we recommend that you check it according to the actual conditions of use. The above conditions have been confirmed by testing the product itself.
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